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Looking ahead, as the mass production of high-speed computing chips featuring 2nm or even 1nm semiconductors and advanced packaging technologies like COWOS and WOW becomes a reality, the challenge of dissipating heat from densely packed high-speed chips becomes increasingly critical. To address this, the utilization of high thermal conductivity material, specifically "liquid metal," is essential. Therefore, to drive the research and development of more efficient liquid metal thermal conductive materials, it's imperative to establish local production capabilities. In pursuit of this goal, Winchain Materials Co., Ltd. has partnered with the Institute of Materials and Chemistry at the Industrial Technology Research Institute to develop and mass-produce liquid metal. A factory will be established in Pingtung Science Park to cater to both domestic and international customers. This initiative not only ensures a local supply chain but also positions Taiwan to lead in the crucial technology of high thermal conductivity materials, thus expediting industrial advancement.

此外，與化學材料大廠長興材料工業股份有限公司，合作開發高熱傳導率--高K值TIM材料，含相變化材料Phase change material）、高K值導熱凝膠（Gap Filler）、高K值Grease、沒浸式Grease、Silicone&Non-Silicone..等），結合雙方在研發及製造上的優勢（宇晨材料在液態金屬，長興材料在有機化合物），開發各項高K值的TIM材料，結合雙方在研發技術及市場銷售的優勢，達成雙贏，同時增加宇晨材料產品品項以提供給客戶之Total SolutionTIM材料解決方案。