Latest Products & Services
Our gallium-based low-melting-point alloy remains in a stable liquid state at room temperature. It is non-toxic, non-volatile, and engineered for safe, reliable use in thermal management applications. As the next-generation Thermal Interface Material (TIM), it delivers industry-leading thermal conductivity of 72–85 W/m·K. By minimizing interface thickness to the absolute limit, it achieves ultra-low thermal resistance, maximizing heat transfer efficiency between critical components and heat sinks. This advanced material is ideally suited for high-power electronics, including: • AI processors & accelerators • High-end CPUs & gaming GPUs • 5G and high-speed communication modules • Power-dense semiconductor devices It represents the cutting edge of thermal interface technology, making it the preferred solution for applications where traditional greases or pastes fall short.
Applications:
The Liquid Metal Polymer Cover is a smart, protective solution specifically designed for thermal modules, preventing liquid metal leakage and safeguards surrounding components like capacitors—ensuring system safety and preventing short-circuit damage.
Our Liquid Metal Dispenser enables automated, precision coating of thermal surfaces, improving production efficiency and thermal interface performance. Winchain offers full technical assistance and system integration support.
This high-performance thermal grease is formulated with custom silicone oil, liquid metal, and functional additives, synthesized through proprietary dispersion technology. The liquid metal is surface-modified to prevent aggregation or phase separation, to ensure uniform distribution within the silicone matrix. This optimized formulation significantly enhances printing stability and mass production yield.
Delivers excellent thermal conductivity and ultra-low thermal resistance, with outstanding durability across wide temperature ranges. Effectively fills air gaps between chips and heat sinks to enhance heat flow, lower chip temperatures, and extend component lifespan.
Properties:
Applications:
A high-performance TIM 1 material formulated with reactive silicone base, Liquid Metal, and thermal fillers, engineered through proprietary dispersion technology. The liquid metal is uniformly dispersed with no segregation or leakage. It withstands 260 °C reflow temperatures, and partially cures under heat to reduce chip warpage. Its composite thermal pathway significantly lowers interfacial thermal resistance, delivering superior performance over conventional TIM 1 materials for advanced packaging applications.
A high-performance TIM 1 thermal grease designed for advanced chip packaging, formulated with reactive silicone and multifunctional thermal fillers using proprietary mixing and dispersion technology.
Similar to its Liquid Metal counterpart, it undergoes reflow temperatures up to 260 °C and cures under heat to mitigate chip warpage in packaging structures. Its multi-filler thermal pathway significantly reduces interfacial thermal resistance, offering performance that surpasses conventional TIM 1 materials.
This thermal grease is formulated with specialized silicone oil and high-efficiency thermal fillers, using proprietary dispersion techniques to achieve uniform distribution and material stability.
It combines high thermal conductivity with long-lasting wettability and resists drying or hardening over time.
With excellent electrical insulation and non-corrosive properties, the material helps reduce interfacial thermal resistance. Comparable in performance to leading global TIMs, it offers a cost-effective solution for high-performance applications.
Properties:
Applications:
Non-silicone thermal grease formulated with ester oil to eliminatethe formation of siloxane compounds. It prevents issues like fogging on optical surfaces and reduces the risk of terminal contamination or short circuits in electronic components.
This material operates from -40 °C to 150 °C, non-volatile, and resists drying for long-term reliability.
Properties:
Applications:
Specifically developed for immersion-cooled systems using PAO (polyalphaolefin) fluids, this high-performance thermal grease is the only known alternative to Indium foil that withstands direct PAO exposure -offering long-term stability without decomposition or hardening.
Validated by global customers, it delivers lower thermal resistance than indium, reduces server chip temperatures, and offers a more cost-effective alternative.
Properties:
Applications:
This uniquely blue thermal grease is formulated with specialty silicone oil and proprietary high-conductivity fillers. Unlike conventional greys, its striking color enhances product identity while maintaining excellent thermal performance, long-term stability, and strong material compatibility without drying, hardening, or corrosion.
Properties:
Applications:
Formulated with specialty silicone oil, advanced conductive fillers, and multifunctional additives, this thermal grease delivers excellent conductivity, insulation, and long-term stability without oil separation. It fills surface gaps to lower component temperatures and extends device life. With lower density and superior stiffness compared to competitors, it offers outstanding cost-performance value.
Properties:
Applications:
A high-performance phase-change thermal pad made with proprietary polymers, conductive fillers and multifunctional additives.
It melts at 45 °C, ensuring excellent thermal conductivity, electrical insulation, and temperature resistance.
Its phase-change behavior absorbs thermal shock and prevents pump-out, offering top-tier performance with easier application and better cost-efficiency than imported alternatives.
Properties:
Applications:
Datasheets
Datasheets
Datasheets
Datasheets